MiLi Task 3 Electronic and Opto-electronics Development Details
| Task | Title | Description | Lead | Participants |
| 3.1 | Preliminary Electrical Design | During this task, AISE group from INTA shall define the preliminary design of the electronics and opto-electronics subsystem.
A special effort shall be made on selecting (which may include some bread-board testing) the more suitable laser
to be used on the LIDAR, based on the technical requirements from Task 1. | INTA | |
| 3.2 | Instrument Control Unit Design | The group shall evaluate correctly the required processing needs and memory capacity to facilitate the correct interface
towards the Front-End Electronics (FEE). The control unit shall deliver the appropriate and noise-free secondary power
voltages towards actuator and sensor electronics. | INTA | |
| 3.3 | Si PMT Breadboarding and behavioural Design | This task is key on improving the state of the art in terms of signal-to-noise ratio achieved by the LIDAR's sensor. The
selection of this new Si PMT technology, allows for high-speed measurements, however, it is key to understand how to
deal with the cross-talk effect, and to maximize the capability of this technology by combining the analogue and pulse
counting modes in the best achievable way.
| INTA | |
| 3.4 | Front-End Electronics Design | Improving the performance of low-noise/high-frequency FEE is always on the boundaries of SoA. This task shall be
used to study and test the best combination for the driver interface (towards laser), and the receiver interface (from the
Si PMT sensor). The schematics and PCB design shall be merged with ICU design to be manufactured. | INTA | |
| 3.5 | PCB Manufacturing | The team shall prepare the documentation needed for the formal validation of the electronics. The
EEE components acquired during the purchase phase shall be mounted on the manufactured PCBs. | INTA | |
| 3.6 | PCB Population | The team shall prepare the documentation needed for the formal validation of the electronics. The
EEE components acquired during the purchase phase shall be mounted on the manufactured PCBs. | INTA | |
| 3.7 | Electronics Validation | A complete verification of the electronics against its requirements shall be undertaken. Also, the design documents shall
be concluded. | INTA | York U |
